We have multiple lithography tools include a deep -ultraviolet scanner, electron beam lithography tools and optical proximity/contact and backside aligners.
We offer deposition technologies such as chemical vapour deposition systems, physical layer deposition (sputter and evaporation) and atomic layer deposition.
We have reactive ion etching (including inductively coupled plasma) and ion beam dry etch tools as well as wet etching systems.
We provide a range of equipment for device and materials characterisation, at both individual die and wafer level.
We offer chemical mechanical polishing (CMP) tools for dielectric, metal and post-CMOS copper planarisation up to 200 millimetre wafers.
We offer scribe, dice and bonding from chip level to heterogenous wafer scale.
We can provide flexible back-end-of-line copper processing including electroplating and CMP.